Method for manufacturing multi-layer printed circuit board

Details Method for manufacturing multi-layer printed circuit board Method for manufacturing multi-layer printed circuit board

1998-12-02

2000-09-19

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 427 97, H05K 336

Patent

active

061193356

ABSTRACT:
A method for manufacturing a build-up multi-layer printed circuit board for use in computers, VTR, or portable telephones is disclosed, in which the method of forming a hole in a circuit layer and the method of forming a hole in an insulating layer are made different from each other by applying a combined formation method, thereby improving the formation precision and efficiency in forming the holes. Specifically, a resin-clad copper foil (RCC) is stacked on a CCL (copper-clad laminate) after forming a printed circuit layer, and this structure is heated and pressed. Then, beams of an Nd-YAG laser are irradiated to remove the copper-clad layer, and then beams of CO.sub.2 laser are irradiated to remove the residual resin insulator, thereby forming a via hole. Then, circuit patterns are formed on the board on which the via hole has been formed.

REFERENCES:
patent: 4933045 (1990-06-01), DiStefano et al.
patent: 5232548 (1993-08-01), Ehrenberg et al.
patent: 5258094 (1993-11-01), Furui et al.
patent: 5263243 (1993-11-01), Taneda et al.
patent: 5699613 (1997-12-01), Chong et al.

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