Method for manufacturing multi-layer printed board

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With bond interfering means

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156598, B32B 3500

Patent

active

056267134

ABSTRACT:
An apparatus for producing a multi-layer printed circuit board. The printed circuit board includes a bottom layer board, a hole board, and an adhesive sheet between the bottom layer board and the hole board. The printed circuit board is heated so that adhesive sheet bonds the bottom layer board to the hole board. A mold release sheet and a thermoplastic resin sheet begins to soften at a temperature lower than the melting temperature of the adhesive. A contraction control member controls contraction when the thermoplastic resin sheet cools.

REFERENCES:
patent: 4106187 (1978-08-01), Smith et al.
patent: 4680075 (1987-07-01), McNeal et al.
patent: 4737208 (1988-04-01), Bloechle et al.
patent: 5116440 (1992-05-01), Takeguchi et al.

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