Method for manufacturing multi-layer printed board

Details Method for manufacturing multi-layer printed board Method for manufacturing multi-layer printed board

1994-01-19

1995-10-24

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156293, 156323, B32B 3104, B32B 3120

Patent

active

054606802

ABSTRACT:
A method for producing multi-layer printed board. The method includes heating a hole board as a top layer, an adhesive sheet, and a bottom layer board. The adhesive sheet includes a mold release sheet and a thermoplastic resin sheet which begins to soften at a temperature lower than the melting temperature of the adhesive. A contraction control member controls contraction when the thermoplastic resin sheet cools.

REFERENCES:
patent: 4106187 (1978-08-01), Smith et al.
patent: 4636275 (1987-01-01), Norell
patent: 4680075 (1987-07-01), McNeal et al.
patent: 4737208 (1988-04-01), Bloechle, Jr. et al.
patent: 5116440 (1992-05-01), Takeguchi et al.

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