Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1996-04-12
1999-08-17
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438108, H01L 2144
Patent
active
059406860
ABSTRACT:
A multi-chip module made by using a direct attach method for manufacturing a multi-chip module by manufacturing a plurality of chips using a direct attach method and encapsulating the multi-chip models. The direct-attach method of manufacturing includes providing a special-design printed circuit board, manufacturing a lead frame with special design features including a central cavity for accommodating the specially designed printed circuit board and chips, assembling the lead frame and the printed circuit board using a conductive epoxy and curing the lead frame and printed circuit board assembly. The special-design printed circuit board includes a plurality of locating holes used for aligning the lead frame with the printed circuit board, a plurality of peripheral holes adapted to receive a corresponding lead frame finger, non-pointed corners, a silver or gold final plurality and a dry film.
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Conexant Systems Inc.
Picardat Kevin M.
Yu Philip K.
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