Method for manufacturing MOS type semiconductor device

Fishing – trapping – and vermin destroying

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437 41, 437203, 148DIG126, H01L 21265

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active

057211485

ABSTRACT:
In a method for manufacturing a MOS type semiconductor device, a first conductivity type layer is formed in a surface layer of a second conductivity type base region on a first conductivity type drain layer, a gate trench is formed in the base region, and a gate electrode is then formed in the gate trench through a gate insulation film. An exposed surface of the obtained structure is covered with an inter-layer insulation film, and a source contact trench that reaches inside the second conductivity type base region is formed through the inter-layer insulation film and first conductivity type layer while a gate contact trench that reaches inside the gate electrode is formed through the inter-layer insulation film. A portion of the inter-layer insulation film and the source contact trench are covered with a first metal film that forms a source electrode, and another portion of the inter-layer insulation film and the gate contact trench are covered with a second metal film that forms a gate metal electrode.

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