Fishing – trapping – and vermin destroying
Patent
1996-12-03
1998-02-24
Niebling, John
Fishing, trapping, and vermin destroying
437 41, 437203, 148DIG126, H01L 21265
Patent
active
057211485
ABSTRACT:
In a method for manufacturing a MOS type semiconductor device, a first conductivity type layer is formed in a surface layer of a second conductivity type base region on a first conductivity type drain layer, a gate trench is formed in the base region, and a gate electrode is then formed in the gate trench through a gate insulation film. An exposed surface of the obtained structure is covered with an inter-layer insulation film, and a source contact trench that reaches inside the second conductivity type base region is formed through the inter-layer insulation film and first conductivity type layer while a gate contact trench that reaches inside the gate electrode is formed through the inter-layer insulation film. A portion of the inter-layer insulation film and the source contact trench are covered with a first metal film that forms a source electrode, and another portion of the inter-layer insulation film and the gate contact trench are covered with a second metal film that forms a gate metal electrode.
REFERENCES:
patent: 4984030 (1991-01-01), Sunami et al.
patent: 5081052 (1992-01-01), Kobayashi et al.
patent: 5208172 (1993-05-01), Fitch et al.
patent: 5244824 (1993-09-01), Sivan
patent: 5424231 (1995-06-01), Yang
patent: 5429970 (1995-07-01), Hong
patent: 5474943 (1995-12-01), Hshieh et al.
patent: 5510287 (1996-04-01), Chen et al.
patent: 5514604 (1996-05-01), Brown
patent: 5576245 (1996-11-01), Cogan et al.
Fuji Electric Co.
Lebentritt Michael S.
Niebling John
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