Method for manufacturing micro electro-mechanical systems...

Details Method for manufacturing micro electro-mechanical systems... Method for manufacturing micro electro-mechanical systems...

2006-03-07

2006-03-07

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S456000, C438S723000

Reexamination Certificate

active

07008817

ABSTRACT:
A method for manufacturing micro electro-mechanical systems includes forming an insulation layer on an upper surface of a semiconductor substrate, forming a structure layer on an upper surface of the insulation layer and etching the structure layer, forming an under bump metal on a predetermined position of an upper surface of the structure layer, forming a via hole in a glass substrate corresponding to the position of the under bump metal and in a shape such that the via hole is larger in diameter at an upper surface of the glass substrate than at a lower surface of the glass substrate, wherein the glass substrate is bonded to the upper surface of the structure layer and creates a vacuum chamber that protects a structure of the structure layer, and arranging a solder ball in the via hole and bonding the solder ball to the under bump metal.

REFERENCES:
patent: 6300676 (2001-10-01), Kawai
patent: 6388335 (2002-05-01), Lam
patent: 6391742 (2002-05-01), Kawai
patent: 6413799 (2002-07-01), Lam
patent: 2002/0008311 (2002-01-01), Kimura
patent: 2002/0088986 (2002-07-01), Kayama et al.
patent: 2002/0146859 (2002-10-01), Akagawa
patent: 2003/0102566 (2003-06-01), Farnworth
patent: 2004/0035917 (2004-02-01), Koopmans
patent: 10213441 (1998-08-01), None

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