Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-07-26
1998-04-21
Culver, Horace M.
Metal working
Method of mechanical manufacture
Electrical device making
29848, 29851, 29852, H05K 103, H05K 114
Patent
active
057406030
ABSTRACT:
A method for manufacturing multiple circuit board for mounting LIS elements and general electronic elements, and which is direcdted to provide a method for manufacturing a porous multiple layer ceramic circuit board in which a granularity of lead-zinc-borate glass (Pb--Zn--B glass) powder mixed together with ceramic powder is classified into two kinds and then the powders classified with granularity is used, so that closed pores of suitable magnitude and quantity are formed within interior even without addition of high molecular open gap type raw material whereby an insulation property and wetproof property are excellent and dielectric constant is low. The invention is made such that only A green sheets are piled by printing a conductor electrode to A green sheet manufactured by mixing 30-70 wt % of ceramic powder and Pb--Zn--B glass powder made of 50-90 wt % of powder being 9-20 wt % in average granular diameter and 10-50 wt % of powder being less than 3 .mu.m in average granular diameter, or else A/B green sheets are alternately piled after printing a conductor circuit to B green sheet used with said A green sheet and calcium silicate crystallized powder, and then pressure heat sealed, and the pressure heat sealed sheet is de-bound and thereafter fired.
REFERENCES:
patent: 4935584 (1990-06-01), Boggs
patent: 5073180 (1991-12-01), Farooq et al.
patent: 5196384 (1993-03-01), Kamezaki et al.
patent: 5480503 (1996-01-01), Casey et al.
patent: 5481795 (1996-01-01), Hatakeyama et al.
Abstracted JP 2-116,196 in English (Published Apr. 27, 1990).
Culver Horace M.
Samsung Electro-Mechanics Co. Ltd.
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