Etching a substrate: processes – Forming or treating thermal ink jet article
Patent
1994-12-27
1995-10-17
Powell, William
Etching a substrate: processes
Forming or treating thermal ink jet article
216644, 216655, 2166591, 216668, 216 41, 216 67, B44C 122, G01D 1500, B29C 3700
Patent
active
054582547
ABSTRACT:
A method for manufacturing a liquid jet recording head includes a first process of forming an ink flow passage pattern on a substrate by a resin layer; a second process of forming a covering resin layer to cover a resin layer on the resin layer; a third process of forming an ink discharging port pattern by a material having resistance to an oxygen plasma on the surface of the covering resin layer; a fourth process of forming ink discharging ports by dry etching the resin layer by the application of the oxygen plasma with the ink discharging port pattern as a mask; and a fifth process of eluting the resin layer. This method enables the ink discharging ports to be formed without cutting the substrate and at the same time, the distance between the ink discharging pressure generating elements and the orifices to be controlled rigidly; hence making it possible to manufacture a liquid jet recording head having a stabilized discharging characteristic.
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Miyagawa Masashi
Ohkuma Norio
Toshima Hiroaki
Canon Kabushiki Kaisha
Powell William
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