Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2005-10-20
2008-12-30
Olsen, Allan (Department: 1792)
Etching a substrate: processes
Forming or treating thermal ink jet article
Reexamination Certificate
active
07470375
ABSTRACT:
A method for precisely manufacturing a liquid supply orifice of an ink-jet recording head, even if a masking material includes pinholes which may affect the forming of the ink supply orifice, is provided. The substrate face provided with a mask used for forming the ink supply orifice has an area covered with the mask for anisotropic etching, the area consisting of a part provided with OSF layers and a part not provided with the OSF layers which are determined by considering the amount of a side etching.
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Fujii Kenji
Koyama Shuji
Nagata Shingo
Osumi Masaki
Yamamuro Jun
Canon Kabushiki Kaisha
Canon USA Inc IP DIV
Olsen Allan
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