Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2007-07-31
2007-07-31
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S002000, C216S041000, C438S021000, C438S745000, C029S890100
Reexamination Certificate
active
10868854
ABSTRACT:
A method for manufacturing a liquid ejection head having a substrate including an electro-thermal transducer for ejecting a liquid from an ejection opening, an electrode wiring section electrically connecting the electro-thermal transducer and driver element thereof, and a liquid supply port therethrough includes the steps of forming a sacrificial layer by using the same material as the electrode wiring section at a position at which the liquid supply port is to be formed during forming the electrode wiring section, forming an anti-etching layer covering the sacrificial layer, removing the sacrificial layer by etching the substrate from a surface thereof opposite to the surface on which the electro-thermal transducer is formed to expose the anti-etching layer of a portion to be the liquid supply port, and removing the exposed anti-etching layer to form the liquid supply port in the substrate.
REFERENCES:
patent: 4263601 (1981-04-01), Nishimura et al.
patent: 5804083 (1998-09-01), Ishii et al.
patent: 5877791 (1999-03-01), Lee et al.
patent: 6143190 (2000-11-01), Yagi et al.
patent: 6305080 (2001-10-01), Komuro et al.
patent: 6450621 (2002-09-01), Hayakawa
patent: 6663229 (2003-12-01), Komuro et al.
patent: 2002/0075359 (2002-06-01), Wuu et al.
patent: 2003/0081068 (2003-05-01), Hayakawa et al.
patent: 2006/0071976 (2006-04-01), Baek et al.
patent: 0 841 167 (1998-05-01), None
patent: 54-51835 (1979-04-01), None
patent: 10-13849 (1998-01-01), None
patent: 10-181032 (1998-07-01), None
patent: WO 01/03934 (2001-01-01), None
patent: WO 01/36203 (2001-05-01), None
Komuro Hirokazu
Murooka Fumio
Ahmed Shamim
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
LandOfFree
Method for manufacturing liquid ejection head does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing liquid ejection head, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing liquid ejection head will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3785950