Method for manufacturing liquid discharge head, substrate...

Details Method for manufacturing liquid discharge head, substrate... Method for manufacturing liquid discharge head, substrate...

2007-08-14

2007-08-14

Hsieh, Shih-Wen (Department: 2861)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S045000, C347S054000, C347S063000, C216S027000

Reexamination Certificate

active

11299944

ABSTRACT:
An ink supply port is opened in an Si substrate on which an ink discharge energy generating element is formed, by anisotropic etching, from a back surface opposite to a surface on which the ink discharge energy generating element is formed. When the anisotropic etching is effected, OSF (oxidation induced laminate defect) is remained on the back surface of the Si substrate with OSF density equal to or greater than 2×104parts/cm2and a length of OSF equal to or greater than 2 μm.

REFERENCES:
patent: 4789425 (1988-12-01), Drake et al.
patent: 5347713 (1994-09-01), Shibata et al.
patent: 5389551 (1995-02-01), Kamakura et al.
patent: 5580468 (1996-12-01), Fujikawa et al.
patent: 6107209 (2000-08-01), Ohkuma
patent: 6113222 (2000-09-01), Ohkuma
patent: 6450621 (2002-09-01), Hayakawa
patent: 6540336 (2003-04-01), Kubota et al.
patent: 6609783 (2003-08-01), Koyama et al.
patent: 6858152 (2005-02-01), Koyama et al.
patent: 0 597 302 (1994-05-01), None
patent: 0 750 992 (1997-01-01), None
patent: 0 841 167 (1998-05-01), None
patent: 62-264957 (1987-11-01), None
patent: 11-10896 (1999-01-01), None
patent: 11-78029 (1999-03-01), None
patent: 2000-153613 (2000-06-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing liquid discharge head, substrate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing liquid discharge head, substrate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing liquid discharge head, substrate... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3872984