Method for manufacturing integrated circuits by guardbanding...

Details Method for manufacturing integrated circuits by guardbanding... Method for manufacturing integrated circuits by guardbanding...

2006-12-21

2010-12-21

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

C438S014000, C438S460000, C257SE21521

Reexamination Certificate

active

07855088

ABSTRACT:
The invention provides a method for manufacturing an integrated circuit. The method, in one embodiment, includes inspecting a semiconductor wafer including a plurality of die for a defect, the inspecting providing an image of the semiconductor wafer including the defect. The method further includes identifying an area of the semiconductor wafer from the image, wherein the identified area encompasses at least those die including any portion of the defect, and dicing the semiconductor wafer into individual die. The die defined by the identified area, in this embodiment, are then discarded.

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English machine translation of Jaoanese patent JP2003046220A, Method and Device for Inspecting Substrate and Method of Manufacturing Substrate, Feb. 14, 2003.

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