Method for manufacturing image sensor

Details Method for manufacturing image sensor Method for manufacturing image sensor

2006-12-15

2008-11-25

Dang, Trung (Department: 2892)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S069000, C257SE21617, C257SE27133, C257SE31127

Reexamination Certificate

active

07456044

ABSTRACT:
A method of manufacturing an image sensor using a microlens mold is provided. The method includes: forming an interlayer dielectric layer on a semiconductor substrate having photodiodes; forming color filter layers on the interlayer dielectric layer; forming a planarization layer on the color filter layers; coating photoresist on the planarization layer; aligning a mold having a lens shaped pattern on the semiconductor substrate with the photoresist applied thereon; pressing the mold and the semiconductor substrate closely to each other such that a pattern formed in the mold is transferred onto the photoresist; and separating the mold from the semiconductor substrate, thereby forming micro-lenses.

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