Method for manufacturing IC plastic package with window

Details Method for manufacturing IC plastic package with window Method for manufacturing IC plastic package with window

1985-05-08

1987-05-12

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

357 72, 26427217, H01L 2328, H01L 2332

Patent

active

046638334

ABSTRACT:
A method for manufacturing a plastic IC package with a light receiving window, for a semiconductor IC device, which includes the steps of preparing a lead frame supporting member provided, in a central portion of a main surface thereof, with a groove for receiving a liquid molding resin therein, disposing an IC lead frame on the lead frame supporting member within a mold, and molding a plastic package so as to enclose the IC lead frame and the lead frame supporting member therein and to form an opening in the plastic package at a portion corresponding to the IC chip mounting area of the IC lead frame. An IC chip is then mounted on the IC chip mounted area and interconnected by wires with the leads of the IC lead frame. Then a light transmitting window plate is adhesively fixed over the opening in the molded plastic package.

REFERENCES:
patent: 3611061 (1971-10-01), Segerson
patent: 3981074 (1976-09-01), Yamamoto et al.
Lazlo, Jr., "The Japanese Semiconductor Industry, Robust Industry Conditions to Persist through 1984", Hambrecht and Quist Inc., 1/84.

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