Method for manufacturing IC packages

Details Method for manufacturing IC packages Method for manufacturing IC packages

1982-03-10

1984-08-07

Lin, Kuang Y.

Metal fusion bonding

Process

With clamping or holding

B23K 3102

Patent

active

044638922

ABSTRACT:
Disclosed is a method and an article formed thereby which includes a part which is subjected to heat during fabrication of an IC package, and a fixture for holding such a part, having an arrangement for accommodating the expansion and contraction of the part during heating and cooling while holding the part in alignment. In one embodiment, the expansion and contraction arrangement comprises slots arranged as apices of a triangle in the part which receives pins in the fixture with the major axes of the slots in alignment with the point of minimum expansion and contraction of the part. Utilizing the triangulation principle, the location of the datum hole (or locating criteria), if not at the point of minimum expansion and contraction of the part, can be effectively translated to the center of minimum expansion and contraction.

REFERENCES:
patent: 1885960 (1932-11-01), Doyle
patent: 3786556 (1974-01-01), Weston

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