Method for manufacturing IC card substrate

Details Method for manufacturing IC card substrate Method for manufacturing IC card substrate

1993-12-21

1995-12-19

Fiorilla, Christopher A.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Shaping against forming surface

26432812, B29C 4500

Patent

active

054766290

ABSTRACT:
A method for manufacturing a substrate for an IC card in which, after a synthetic resin is filled into a cavity in an IC card substrate forming mold, or after a core pin for forming an IC module housing recessed section in the cavity in an IC card substrate forming mold is caused to project as far as an intermediate position, and the synthetic resin is filled into the cavity, the core pin is further caused to project to a specified position to form the IC module housing recessed section while the synthetic resin is in the mobile state.

REFERENCES:
patent: 4097571 (1978-06-01), Cox
patent: 4154784 (1979-05-01), Ruhl
patent: 5030309 (1991-07-01), Brignet et al.
patent: 5149479 (1992-09-01), Nakajima

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