Method for manufacturing hybrid integrated circuits

Details Method for manufacturing hybrid integrated circuits Method for manufacturing hybrid integrated circuits

1989-02-21

1990-04-10

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29412, 29413, 437226, H05K 339

Patent

active

049148150

ABSTRACT:
In a method for manufacturing hybrid integrated circuits, a plurality of circuit patterns are formed on one surface of a board, and a connecting film is stuck onto the other surface of the board. Then, the board is divided into portions having the respective circuit patterns while leaving the connecting film intact and component parts are mounted on the portions. Finally, the individual portions are separated by cutting the connecting film. The circuit patterns may be formed over one surface of the board and covered with a connecting film. The connecting film may be a constituent element of each circuit pattern, such as an insulating layer disposed between conducting layers.

REFERENCES:
patent: 4266334 (1981-05-01), Edwards et al.
patent: 4572757 (1986-02-01), Spadafora
patent: 4617729 (1986-10-01), Celnik
Ozawa et al., "Micro Hybrid Circuits for Surface Mounting Technology", 1986 IEEE, pp. 10-15.

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