Method for manufacturing high-frequency module device

Details Method for manufacturing high-frequency module device Method for manufacturing high-frequency module device

2007-02-26

2010-06-22

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S108000, C438S126000, C438S381000, C438S458000, C438S622000, C257S728000, C257SE21501, C257SE21511

Reexamination Certificate

active

07741162

ABSTRACT:
This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit (2) in which first to third unit wiring layers (5) to (7), each having a capacitor (12) or the like at a part, are stacked and formed on flattened one surface of a dummy board (30) so that a third pattern wiring is exposed from a connection surface (2a) of an uppermost layer is mounted on a mounting surface (3a) of a base board (3) where an input/output terminal part (18) is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.

REFERENCES:
patent: 5239448 (1993-08-01), Perkins et al.
patent: 6919226 (2005-07-01), Ogawa et al.
patent: 7183135 (2007-02-01), Ogawa et al.
patent: 06-318783 (1994-11-01), None
patent: 07-202427 (1995-08-01), None
patent: 2002-164467 (2002-07-01), None
patent: WO 02/061827 (2002-08-01), None
Machine translation of JP 2002-164467.

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