Method for manufacturing high-frequency module device

Details Method for manufacturing high-frequency module device Method for manufacturing high-frequency module device

2007-02-27

2007-02-27

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257SE21511

Reexamination Certificate

active

10496878

ABSTRACT:
This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit (2) in which first to third unit wiring layers (5) to (7), each having a capacitor (12) or the like at a part, are stacked and formed on flattened one surface of a dummy board (30) so that a third pattern wiring is exposed from a connection surface (2a) of an uppermost layer is mounted on a mounting surface (3a) of a base board (3) where an input/output terminal part (18) is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.

REFERENCES:
patent: 6919226 (2005-07-01), Ogawa et al.
patent: 2004/0077124 (2004-04-01), Ogawa
patent: 6-318783 (1994-11-01), None
patent: 7-202427 (1995-08-01), None
patent: WO 02/061827 (2002-08-01), None

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