Method for manufacturing heat-stable structured layers from phot

Details Method for manufacturing heat-stable structured layers from phot Method for manufacturing heat-stable structured layers from phot

1990-02-16

1990-12-04

Hamilton, Cynthia

Radiation imagery chemistry: process, composition, or product th

Imaged product

Including resin or synthetic polymer

430325, 430311, 430296, 430 14, 430 20, 430945, 430942, 430284, 522 97, 522 96, G03F 7038, G03F 732

Patent

active

049753479

ABSTRACT:
Heat-stable structured layers can be manufactured through the application of radiation-sensitive soluble polymers in the form of a layer or film on a substrate, irradiation of the layer respectively film through negative patterns with actinic light or through the use of a light, electron, laser, or ion beam, removal of the non-irradiated layer respectively film parts and, if necessary, through subsequent tempering, in a cost-effective way in dimension-precise and high-quality form and in a single application process, when the polymers used are photopolymers in the form of addition reaction products of olefinic unsaturated monoisocyates with phenolformaldehyde resins. The layers produced with this method resist even high thermal and mechanical stress in immersion soldering processes and protect circuit surfaces effectively and permanently against moisture and corrosion; they are therefore suitable for use, in particular as solder resist and insulating layers in microelectronics.

REFERENCES:
patent: 2791504 (1957-05-01), Plambeck, Jr.
patent: 2997391 (1961-08-01), Murray et al.
patent: 3644289 (1972-02-01), Sayigh et al.
patent: 3694415 (1972-09-01), Honda et al.
patent: 4304923 (1981-12-01), Rousseau
patent: 4390615 (1983-06-01), Courtney et al.
patent: 4587204 (1986-05-01), Davis
W. S. DeForest, Photoresist: Materials and Processes, McGraw-Hill Book Company, New York, NY, 1975, pp. 244-246.

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