Method for manufacturing heat-stable structured layers based on

Radiation imagery chemistry: process – composition – or product th – Imaged product – Including resin or synthetic polymer

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430280, 430284, 430287, 430325, 430330, 430296, 430945, 522 97, 522 96, G03C 170, G03C 516, G03F 726

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active

048837300

ABSTRACT:
A method of manufacturing heat-stable structured layers by applying a radiation-sensitive soluble photopolymer in the form of a layer or film on a substrate, irradiating the layer or film through a negative pattern with actinic light or through the use of a light, electron, laser, or ion beam, removing the non-irradiated layer or film parts and, optionally tempering the remaining parts is described wherein the photopolymer comprises an addition reaction product of an olefinically unsaturated monoisocyanate and a hydroxyl group-containing epoxy compound. The invention provides a cost-effective method of manufacturing dimension-precise structured layers of high quality in a single coating process. The layers produced with this method even resist high thermal and mechanical stresses in immersion soldering processes, and protect circuit surfaces effectively and permanently against moisture and corrosion. They are suitable for use, in particular, as solder resist and insulating layers in microelectronics.

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W. S. DeForest, Photoresist: Materials and Processes Chapter Four, "Negative Resists", McGraw-Hill Book Company, New York, N.Y., 1975, pp. 89-131.
R. Darms, "Angewandte Chemie/Chemie-Ingenieurwesen"Chimia 38, no. 1 (1984).

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