Method for manufacturing heat radiating resin-molded semiconduct

Details Method for manufacturing heat radiating resin-molded semiconduct Method for manufacturing heat radiating resin-molded semiconduct

1997-02-28

1998-08-04

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257706, 257707, H01L 2328

Patent

active

057898200

ABSTRACT:
In a method for manufacturing a heat radiating resin-molded semiconductor device, a protrusion is formed on a side peripheral surface of a semiconductor chip, and the semiconductor chip is sealed with resin, so that spreading of the resin toward a back surface of the semiconductor chip is prevented by the protrusion. Also, a heat radiator is mounted on a back surface of the semiconductor chip.

REFERENCES:
patent: 5397746 (1995-03-01), Blish, II

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