Method for manufacturing heat pipe cooling device

Details Method for manufacturing heat pipe cooling device Method for manufacturing heat pipe cooling device

2005-12-22

2008-11-25

Flanigan, Allen J (Department: 3744)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C361S700000

Reexamination Certificate

active

07455102

ABSTRACT:
A method for manufacturing a heat pipe cooling device. The heat pipe cooling device includes a U-shaped heat pipe, which is embedded within a heat conductor. The heat conductor includes a rectangular base and an upper cover connected to the base. The base includes many retaining grooves which allow the absorption end of the heat pipe to be disposed therein. The upper cover includes many through holes formed thereon corresponding to the cooling end of the heat pipe. The bottom surface includes many protrusive portions corresponding to the inner side of the absorption end of the heat pipe. Furthermore, the upper cover and the base both include a positioning portion for engaging each other. In this manner, the upper cover is pressed on the cooling end of the heat pipe. The protrusive portion will push the heat pipe to tightly contact with the base. Finally, a planarization process is performed, thereby making the bottom surface of the absorption end and the bottom surface of the heat conductor to form a flat surface.

REFERENCES:
patent: 6830098 (2004-12-01), Todd et al.
patent: 6915844 (2005-07-01), Chou
patent: 6938682 (2005-09-01), Chen et al.
patent: 6945319 (2005-09-01), Li et al.
patent: 6978829 (2005-12-01), Lin
patent: 7021368 (2006-04-01), Lin et al.
patent: 2003/0102108 (2003-06-01), Sarraf et al.
patent: 2003/0218849 (2003-11-01), Mochizuki et al.
patent: 2005/0257920 (2005-11-01), Sheng et al.
patent: 2006/0011329 (2006-01-01), Wang et al.
patent: 2006/0082972 (2006-04-01), Kim

Affiliated with

Also associated with

Rating

Method for manufacturing heat pipe cooling device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing heat pipe cooling device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing heat pipe cooling device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4037562