Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2005-06-07
2005-06-07
Smoot, Stephen W. (Department: 2813)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S459000, C438S463000, C438S479000
Reexamination Certificate
active
06902989
ABSTRACT:
A method for manufacturing a gallium nitride (GaN)-based single crystalline substrate includes the steps of (a) forming a GaN-based single crystalline bulk on an upper surface of a growth substrate; (b) forming grooves through the growth substrate so that the growth substrate is patterned and divided into several units by the grooves, each of the grooves having a designated width; and (c) separating the GaN-based single crystalline bulk from the growth substrate by irradiating a laser beam on a lower surface of the growth substrate.
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Na Jeong Seok
Park Young Ho
Yoo Seung Jin
Lowe Hauptman & Berner LLP
Samsung Electro-Mechanics Co. Ltd.
Smoot Stephen W.
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