Method for manufacturing flip-chip type semiconductor device...

Details Method for manufacturing flip-chip type semiconductor device... Method for manufacturing flip-chip type semiconductor device...

2006-03-01

2008-11-18

Smith, Matthew S. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S674000, C438S678000, C438S906000

Reexamination Certificate

active

07452749

ABSTRACT:
In a method for manufacturing a semiconductor device, either a nickel layer or a nickel-based metal layer is formed on a semiconductor substrate by using a plating process. Then, either the nickel layer or the nickel-based metal layer is washed with one of an aqueous hydrochloric acid solution and an aqueous sulfuric acid solution.

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