Method for manufacturing flexible printed circuit boards

Details Method for manufacturing flexible printed circuit boards Method for manufacturing flexible printed circuit boards

2006-08-01

2008-11-18

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S106000, C257S685000, C257S686000, C257S687000, C257S688000, C257SE23055, C257SE23177

Reexamination Certificate

active

07452754

ABSTRACT:
A method for manufacturing of flexible printed circuit boards is provided. The method includes the steps of: providing a tape substrate having an electrically insulating layer and an electrically conducting layer; forming a wiring pattern at the electrically conducting layer; attaching a back film on a surface of the tape substrate; and cutting the tape substrate to get a number of flexible printed circuit boards attached on the back film.

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patent: 2006/0096701 (2006-05-01), Shiozawa
patent: 1264270 (2000-08-01), None

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