Method for manufacturing flat substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor...

Reexamination Certificate

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C257S064000, C257SE31043, C257SE31045

Reexamination Certificate

active

07897966

ABSTRACT:
For avoiding the metallic inner surface of a PECVD reactor to influence thickness uniformity and quality uniformity of a μc-Si layer (19) deposited on a large-surface substrate, (15) before each substrate is single treated at least parts of the addressed wall are precoated with a dielectric layer (13).

REFERENCES:
patent: 5177578 (1993-01-01), Kakinoki et al.
patent: 5677236 (1997-10-01), Saitoh et al.
patent: 5811195 (1998-09-01), Bercaw
patent: 5863602 (1999-01-01), Watanabe et al.
patent: 5970383 (1999-10-01), Lee
patent: 5981899 (1999-11-01), Perrin et al.
patent: 6071573 (2000-06-01), Koemtzopoulos
patent: 6335540 (2002-01-01), Zhang
patent: 6530992 (2003-03-01), Yang et al.
patent: 6790793 (2004-09-01), Nishino et al.
patent: 6828254 (2004-12-01), Han et al.
patent: 6881684 (2005-04-01), Aota et al.
patent: 6902629 (2005-06-01), Zheng et al.
patent: 6974781 (2005-12-01), Timmermans et al.
patent: 7204913 (2007-04-01), Singh et al.
patent: 2005/0214454 (2005-09-01), Yang et al.
patent: 2005/0257747 (2005-11-01), Wakabayashi et al.
patent: 2006/0205205 (2006-09-01), Han et al.
patent: 2002-289557 (2002-04-01), None
P. Roca I Cabarrocas, “Microcrystalline silicon: An emerging material for stable thin-film transistors,” Journal of the SID, Dec. 1, 2004.

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