Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof
Patent
1984-07-20
1986-03-25
Nielsen, Earl
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
From carboxylic acid or derivative thereof
528361, C08G 5924, C08G 5942
Patent
active
045784523
ABSTRACT:
This application relates to methods for the manufacture of leakage current-proof epoxy-resin molded materials from epoxy resin mixture based on di- or polycarboxylic-acid glycidyl esters, di- or polyfunctional cycloaliphatic olefinic epoxides and dicarboxylic-acid anhydrides, carried out in such a manner that molded materials with good mechanical properties are obtained also for parts of large volume. For this purpose, the invention provides that, by means of the experimentally determined time necessary to reach the maximum temperature during the cross-linking of the epoxy resin mixture under quasi adiabatic conditions, the rate of cross-linking of the epoxy resin mixture is adjusted, by the addition of a diol or polyol, to at least as long as the time necessary to reach the maximum temperature during cross-linking of the glycidyl ester/dicarboxylic acid anhydride components.
REFERENCES:
patent: 3764584 (1973-10-01), Hope et al.
patent: 3989679 (1976-11-01), Sluis et al.
patent: 4294746 (1981-10-01), Blair et al.
patent: 4336367 (1982-06-01), Morris et al.
patent: 4412047 (1983-10-01), Monnier et al.
Hacker Heinz
Hauschildt Klaus-Robert
Kleeberg Wolfgang
Kretzschmar Klaus
Nielsen Earl
Siemens Aktiengesellschaft
LandOfFree
Method for manufacturing epoxy resin molded materials does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing epoxy resin molded materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing epoxy resin molded materials will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-631737