Measuring and testing – Speed – velocity – or acceleration – Structural installation or mounting means
Patent
1997-05-19
1999-12-21
Williams, Hezron
Measuring and testing
Speed, velocity, or acceleration
Structural installation or mounting means
29827, 257686, G01P 102, H01L 2100
Patent
active
06003369&
ABSTRACT:
A method for manufacturing encapsulated semiconductor devices, including rotary speed sensing devices, by using a lead frame. Electrical terminals of the semiconductor device are electrically connected to electrical leads from the lead frame. The semiconductor device is encapsulated in a plastic housing which is also connected to positioning posts located on the lead frame. The electrical leads are disconnected from the lead frame, permitting additional processing of the semiconductor device, including testing.
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Bialokur Donald Walter
McArdle David John
Theut Joseph William
Tola Jeffry
Continental Teves Inc.
Kwok Helen C.
Williams Hezron
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