Method for manufacturing encapsulated electronic components,...

Details Method for manufacturing encapsulated electronic components,... Method for manufacturing encapsulated electronic components,...

2005-07-26

2005-07-26

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S112000, C438S113000, C438S114000, C438S123000, C438S124000

Reexamination Certificate

active

06921682

ABSTRACT:
A method for manufacturing encapsulated electronic components, particularly integrated circuits, includes the steps of: a) attaching electronic components on a first side of a lead frame and electrically connecting the electronic components to the lead frame; b) using a mould to encapsulate the electronic components with an encapsulating material on just a first side of the lead frame, while a second side of the lead frame is substantially completely shielded with the aid of an adhesive film; and c) removing the adhesive film and separating, along cutting lines, individual encapsulated electronic components. The bonding of the adhesive film to the second side to be shielded of the lead frame takes place between step a) and step b).

REFERENCES:
patent: 3635754 (1972-01-01), Beede
patent: 3754070 (1973-08-01), Dunn et al.
patent: 4980016 (1990-12-01), Tada et al.
patent: 5218759 (1993-06-01), Juskey et al.
patent: 5693573 (1997-12-01), Choi
patent: 5729437 (1998-03-01), Hashimoto
patent: 5977613 (1999-11-01), Takata et al.
patent: 6001671 (1999-12-01), Fjelstad
patent: 6033933 (2000-03-01), Hur
patent: 6048483 (2000-04-01), Miyajima
patent: 6087202 (2000-07-01), Exposito et al.
patent: 6126885 (2000-10-01), Oida et al.
patent: 6130473 (2000-10-01), Mostafazadeh et al.
patent: 6187654 (2001-02-01), Tieber
patent: 6294100 (2001-09-01), Fan et al.
patent: 6331737 (2001-12-01), Lim et al.
patent: 6462406 (2002-10-01), Ohgiyama et al.
patent: 0611129 (1994-08-01), None
patent: 0890425 (1999-01-01), None
patent: 402153354 (1990-06-01), None
patent: 10209190 (1998-08-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing encapsulated electronic components,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing encapsulated electronic components,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing encapsulated electronic components,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3408755