Method for manufacturing electronic parts module

Details Method for manufacturing electronic parts module Method for manufacturing electronic parts module

2009-04-15

2010-12-07

Kim, Paul D (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S842000, C029S854000, C029S855000, C174S260000, C228S044700, C228S180210, C228S180220, C257S726000, C257S727000, C257S738000, C438S108000, C438S612000, C438S613000

Reexamination Certificate

active

07845074

ABSTRACT:
The method for manufacturing an electronic parts module includes an adhesive layer forming process forming an adhesive layer including solder particles on the circuit forming surface in range covering at least the first land part and the second land part; a passive element mounting process positioning a terminal of the passive element on the first land part and sticking the passive element to the base wiring layer through the adhesive layer; an active element mounting process, after the passive element mounting process, positioning a terminal of the active element on the second land part and sticking the active element to the base wiring layer through the adhesive layer; a pressing process solidifying the adhesive layer and melting the solder particles by laminating and thermally pressing a thermosetting sheet onto the circuit forming surface so as to form the resin sealing layer.

REFERENCES:
patent: 6158115 (2000-12-01), Tsukagoshi et al.
patent: 6479757 (2002-11-01), Tsukagoshi et al.
patent: 6841022 (2005-01-01), Tsukagoshi et al.
patent: 2009/0097214 (2009-04-01), Lee et al.
patent: 08104762 (1996-04-01), None
patent: 2007047240 (2007-02-01), None
patent: 2007-088009 (2007-04-01), None

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