Method for manufacturing electronic parts and electronic parts u

Details Method for manufacturing electronic parts and electronic parts u Method for manufacturing electronic parts and electronic parts u

1998-04-28

2000-02-15

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361816, 361818, 174 35R, 257659, 29840, 29843, H05K 900

Patent

active

060259981

ABSTRACT:
Disclosed is a method for manufacturing electronic parts in which the soldering operation, the operation of checking the soldering and the operation of mounting the shield cases are simplified and in which an improvement is achieved in terms of the dimensional accuracy of the electronic parts. Before a mother board is cut and divided, through-holes 14 formed around sections corresponding to substrates 2 are filled with solder 15. Next, legs 1c of shield cases 1 are inserted into the solder 15 such that they are brought into close contact with the inner peripheral surfaces of the through-holes 14, and the legs 1c are secured in position by reflow soldering. Then, the mother board is cut so as to separate the through-holes 14 (the solder 15), whereby electronic parts are obtained each of which is composed of a shield case 1 and a substrate 2 on the sides 2b and 2c of which the solder 15 is exposed.

REFERENCES:
patent: 4572757 (1986-02-01), Spadafora
patent: 5140745 (1992-08-01), McKenzie, Jr.
patent: 5625935 (1997-05-01), Kubota et al.

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