Method for manufacturing electronic device including package

Details Method for manufacturing electronic device including package Method for manufacturing electronic device including package

2008-01-22

2008-01-22

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S125000, C257SE21500, C257SE21510, C257SE21511

Reexamination Certificate

active

10941929

ABSTRACT:
In a method for manufacturing an acceleration sensor device, a lid for covering an opening of a package body is prepared by stamping. The lid is plated and plating films are formed on surfaces of the lid. The burrs formed on the surfaces of the lid in the plating process are removed by chemical polishing. A semiconductor sensor chip is inserted in the package body through the opening and fixed. Then, the lid 70 is attached to the package body.

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