Method for manufacturing electronic device including a vibration

Details Method for manufacturing electronic device including a vibration Method for manufacturing electronic device including a vibration

1988-12-14

1990-05-22

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

Vacuum treatment of work

To degas or prevent gas entrapment

264242, 264255, 264261, 264264, 26427213, 26427216, 26427217, B29C 4514

Patent

active

049275801

ABSTRACT:
A method for manufacturing an electronic device having therein a lead frame and a vibration-generating element integrally provided on the lead frame. The lead frame and the element are first provided in a metallic mold assembly comprising an upper mold portion and a lower mold portion, the upper and lower mold portions respectively having recess portions so as to form a cavity when the upper and lower mold portions are assembled with each other. A first sealing material is injected into the cavity so that the element is covered by the injected first sealing material, the first sealing material having a shrinkage property and a low adhesion property. After solidification of the injected first sealing material, they are removed from the mold assembly and then immersed in a second sealing material at a vacuum state so that the second sealing material is impregnated between the first sealing material portion and the lead frame. The second sealing material impregnated therebetween is hardened so as to seal a gap formed therebetween.

REFERENCES:
patent: 4641418 (1987-02-01), Meddles

Affiliated with

Also associated with

Rating

Method for manufacturing electronic device including a vibration does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing electronic device including a vibration, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing electronic device including a vibration will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2133176