Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-05-29
2007-05-29
Fischer, Justin R. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C029S835000, C029S837000, C029S852000, C101S127000
Reexamination Certificate
active
10755313
ABSTRACT:
A method for manufacturing an electronic component includes the steps of inserting tabs of a cover into through holes formed in a circuit board having mounting elements on the front surface thereof, disposing a print mask having openings at positions corresponding to the through holes on the back surface of the circuit board, and supplying solder cream to the through holes through the openings by placing the solder cream on the print mask and moving the solder cream in a predetermined direction with a squeegee. The print mask is provided with projections which project upstream in the moving direction of the solder cream in openings of the print mask, and the openings are shifted upstream in the moving direction of the solder cream. In addition, the tabs are inserted into the through holes such that the width direction of the tabs is along the moving direction of the solder cream.
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Official Communication, including English translation; German Application No. 10 2004 005 685.4-34; Jul. 4, 2005.
Official communication issued in the corresponding German Application No. 10 2004 005 685.4-34, mailed on Jan. 19, 2007.
Fischer Justin R.
Keating & Bennett LLP
Murata Manufacturing Co. Ltd.
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