Method for manufacturing electronic component

Details Method for manufacturing electronic component Method for manufacturing electronic component

2006-01-10

2006-01-10

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S113000

Reexamination Certificate

active

06984572

ABSTRACT:
An electronic circuit is manufactured by the following method. Elements are formed on a front surface of a substrate, and then, a recess is formed around each of the elements in the front surface of the substrate. Then, a portion of the substrate is removed from a back surface of the substrate until reaching the bottom of the recess. In the method, the elements are separated at once by removing the portion of the substrate from the back surface, and thus, the elements are manufactured efficiently.

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