Method for manufacturing electronic apparatus sealed by concave

Details Method for manufacturing electronic apparatus sealed by concave Method for manufacturing electronic apparatus sealed by concave

1996-05-31

1998-08-18

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438107, H01L 2144

Patent

active

057957991

ABSTRACT:
In a method for manufacturing an electronic apparatus, an electronic component is mounted on an organic substrate within its cavity. The electronic component is sealed by a concave molded resin enveloper filled into the cavity.

REFERENCES:
patent: 4633573 (1987-01-01), Scherrer
patent: 5219795 (1993-06-01), Kumai et al.
patent: 5547730 (1996-08-01), Weiblen et al.
patent: 5602059 (1997-02-01), Horiuchi et al.

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