Method for manufacturing electrode plate for plasma processing d

Electric lamp or space discharge component or device manufacturi – Process – Electrode making

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156345, 20429831, 20429833, H01J 912

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active

059613610

ABSTRACT:
A method manufactures an electrode plate for a plasma processing device in which a semiconductor wafer is processed to form a highly integrated circuit. The method includes a curing step of heat-curing a liquid thermosetting resin to prepare a resin forming material one or two backing steps of carbonizing the heat-cured resin forming material by heating under a non-oxidizing atmosphere to prepare a baking material composed of glass-like carbon and a polishing step of polishing one face of the baking material, which is exposed to plasma, to a depth of 20 .mu.m to 1.25 mm.

REFERENCES:
patent: 4582632 (1986-04-01), Rokujo et al.
patent: 5324411 (1994-06-01), Ichishima et al.
patent: 5853523 (1998-12-01), Machida et al.

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