Method for manufacturing electroconductive material-filled...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S830000, C029S874000, C205S125000

Reexamination Certificate

active

07918020

ABSTRACT:
Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.

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Korean Office Action dated Apr. 8, 2009 and partial English translation thereof.
Japanese Office Action dated Dec. 4, 2009 and English translation thereof.
Extended European Search Report dated Nov. 10, 2010.

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