Metal working – Method of mechanical manufacture – Electrical device making
Patent
1997-04-03
1999-04-27
Hail, III, Joseph J.
Metal working
Method of mechanical manufacture
Electrical device making
29878, 29837, 29845, H01R 4300
Patent
active
058966552
ABSTRACT:
A method for the manufacture of electrically conductive lead-throughs for metallized plastic housings. Elevations around the lead-through holes in the housing part are formed at the time of making the housing part (e.g. by injection molding). The entire surface of the housing part is then metallized and the metallization on the elevations around the lead-through holes is removed by mechanical processes that act in one plane and where the lower metallization areas remain unaffected on account of the difference in level. Finally, the metal pins are attached in the lead-through holes by soldering or glueing.
REFERENCES:
patent: 3744129 (1973-07-01), Dewey, Jr.
patent: 4155321 (1979-05-01), Tamburro
patent: 4598470 (1986-07-01), Dougherty, Jr. et al.
patent: 4755631 (1988-07-01), Churchwell et al.
patent: 4775917 (1988-10-01), Eichhorn et al.
patent: 5046243 (1991-09-01), Walker
patent: 5098864 (1992-03-01), Mahulikar
patent: 5102829 (1992-04-01), Cohn
patent: 5492842 (1996-02-01), Eytcheson et al.
H. Yumoto: "Feedthru assembly technique with reduced solder wick". In: Motorola Technical Developments, vol. 12, Apr. 1, 1991, p. 77.
Hail III Joseph J.
Hong William
Kunitz Norman N.
Spencer George H.
TEMIC Telefunken microelectronic GmbH
LandOfFree
Method for manufacturing electrically conductive lead-throughs i does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing electrically conductive lead-throughs i, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing electrically conductive lead-throughs i will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-676402