Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-01-31
2001-11-20
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S723000, C361S756000, C257S719000, C029S877000
Reexamination Certificate
active
06320747
ABSTRACT:
BACKGROUND INFORMATION
Convention method and electric module are described in German Patent Application No. 39 39 628, where the components are glued to ceramic film circuits with a UV curing adhesive or adhesive resin (abbreviated “adhesive”) and the adhesive is cured by irradiating the rear side of the ceramic film circuits with UV light. Curing of the adhesive beneath the entire component is induced by the UV light fraction passing through the substrate.
SUMMARY OF THE INVENTION
A method according to the present invention has the advantage that after precuring of the independent method claim, however, has the advantage that after precuring of the adhesive, the component or a power module can be encased in a gel in another step, and the gel and the adhesive can be fully cured together in one step in a furnace operation after the gelation process. This means considerable time savings in comparison with two separate furnace steps for the adhesive and the gel. It can be regarded as an advantage of the electric module that it has a compact design which guarantees reliable contacting and cooling of the components arranged on the power module.
Edge curing of the adhesive in an edge area of the power module, in particular with UV irradiation, is also advantageous. Therefore, only a small, freely accessible area is necessary for the curing radiation, and the precuring process with UV light requires only a few seconds, so it leads to great time savings in comparison with curing in a furnace process.
Precuring of the adhesive in conjunction with a power module bonding operation has proven to be extremely advantageous. Precuring yields adequate initial bonding of the power module to a fastening part to permit fault-free contacting of the power module in an automated bonding operation. In other words, precuring guarantees adequate fixation of the power module for wire bonding as well as saving a great deal of time in curing the adhesive and the gel used for encasing the power module.
The power module is made ready in an advantageous manner by using a metal conductor frame made of copper in particular, applied to the chip with an electrically conductive adhesive in an electrically conducting bond, for example. Here again, it is possible when curing the adhesive to eliminate a furnace process, which would otherwise be time consuming and tedious in mass production, if the electrically conducting adhesive escaping at the side of the chip is also cured with UV radiation or if, in order to produce an electric connection between the power module and the metallic block, the adhesive is heated in an induction furnace to cure it, i.e., in a furnace where a suitable heating is achieved by eddy currents induced by magnetic induction.
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Brielmann Volker
Ernst Stephan
Jahn Hans-Peter
Datskovsky Michael
Kenyon & Kenyon
Picard Leo P.
Robert & Bosch GmbH
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