Method for manufacturing double-sided printed circuit board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S846000, C427S097200

Reexamination Certificate

active

11122369

ABSTRACT:
An insulating substrate with metal foils on both sides thereof is prepared, and a through hole that passes through the metal foils and insulating substrate is formed. An electroless copper plating layer is formed on an inner surface of the through hole and a surface of each of the metal foils, followed by the formation of an electrolytic copper plating layer on the overall surface of the electroless copper plating layer. After removing the electrolytic copper plating layer except the portions on the inner surface and a peripheral region of the through hole, the metal foils are processed to form conductor patterns.

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