Etching a substrate: processes – Forming or treating a sign or material useful in a sign
Reexamination Certificate
2004-02-06
2009-12-01
Olsen, Allan (Department: 1792)
Etching a substrate: processes
Forming or treating a sign or material useful in a sign
C216S017000, C216S039000, C216S042000, C216S067000, C427S058000, C427S282000, C257SE21174, C257SE21311, C257SE21314, C257SE21414, C257SE21582
Reexamination Certificate
active
07625493
ABSTRACT:
In order to achieve low cost of manufacture of a display device by reducing the use of primary material used in a manufacturing process of a display device and saving labor taken for a vacuum process, according to the invention, liquid droplets containing conductive particles are ejected on a film being processed by using a first liquid droplet ejecting apparatus having a liquid droplet ejecting head provided with a plurality of liquid droplet ejecting orifices, thereby a conductive film is formed. After that, a resist pattern is locally formed on the conductive film by using a second liquid droplet ejecting apparatus having a liquid droplet ejecting head provided with a plurality of liquid droplet ejecting orifices. The conductive film is etched with the resist pattern as a mask to form a wiring.
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Costellia Jeffrey L.
Nixon & Peabody LLP
Olsen Allan
Semiconductor Energy Laboratory Co,. Ltd.
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