Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate
2006-06-13
2006-06-13
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including contaminant removal or mitigation
C438S121000, C438S122000
Reexamination Certificate
active
07060533
ABSTRACT:
A method of manufacturing a diode assembly used in rectifier assemblies of engine-driven generators is disclosed. The diode assemblies have diode cups, semiconductor diode dies and diode leads fitted therein. The diode subassemblies are reflow soldered, such that the semiconductor diode die and diode lead are reflow soldered within a diode cup in an argon/hydrogen atmosphere. In another aspect of the present invention, a lead loader having a removable lead holder that holds diode leads therein is positioned over a diode boat such that the diode leads are aligned with respective diode cups. The lead holder is slid from the lead loader so that the diode leads fall into the center cups which also have the semiconductor die positioned therein. The diode boat is inserted within a furnace for reflow soldering.
REFERENCES:
patent: 3539850 (1970-11-01), Sato
patent: 3629631 (1971-12-01), Colton et al.
patent: 3641374 (1972-02-01), Sato
patent: 3703306 (1972-11-01), LaChance
patent: 3737738 (1973-06-01), Koenig
patent: 3789275 (1974-01-01), Sawano et al.
patent: 3812390 (1974-05-01), Richards
patent: 3925809 (1975-12-01), Striker
patent: 3927338 (1975-12-01), Vieilleribiere
patent: 3930306 (1976-01-01), Goldberg et al.
patent: 3959676 (1976-05-01), Striker
patent: 4074420 (1978-02-01), Lofdahl
patent: 4098452 (1978-07-01), Webster et al.
patent: 4103193 (1978-07-01), Ito
patent: 4189653 (1980-02-01), Hiratuka et al.
patent: 4218694 (1980-08-01), Grzybowski
patent: 4278867 (1981-07-01), Tan
patent: 4321664 (1982-03-01), Matthai
patent: 4419597 (1983-12-01), Shiga et al.
patent: 4496098 (1985-01-01), Kawakatsu
patent: 4604538 (1986-08-01), Merrill et al.
patent: 4606000 (1986-08-01), Steele et al.
patent: 4749980 (1988-06-01), Morrill, Jr. et al.
patent: 4929516 (1990-05-01), Pryor et al.
patent: 4952829 (1990-08-01), Armbruster et al.
patent: 4959707 (1990-09-01), Pinchott
patent: 4978052 (1990-12-01), Fister et al.
patent: 5005069 (1991-04-01), Wasmer et al.
patent: 5043614 (1991-08-01), Yockey
patent: 5071058 (1991-12-01), Nowotarski
patent: 5098514 (1992-03-01), Held
patent: 5331231 (1994-07-01), Koplin et al.
patent: 5409543 (1995-04-01), Panitz et al.
patent: 5438479 (1995-08-01), Heilbronner
patent: 5451823 (1995-09-01), Deverall et al.
patent: 5453648 (1995-09-01), Bradfield
patent: 5659212 (1997-08-01), DePetris
patent: 5682070 (1997-10-01), Adachi et al.
patent: 5773885 (1998-06-01), Steele
patent: 5812388 (1998-09-01), Keidar et al.
patent: 5991184 (1999-11-01), Russell et al.
patent: 6306516 (2001-10-01), Jin et al.
patent: 6476480 (2002-11-01), Staab et al.
patent: 6528911 (2003-03-01), De Petris
patent: 6667545 (2003-12-01), Spitz
patent: 197 11 955 (1997-10-01), None
patent: 0 411 596 (1991-02-01), None
patent: 0 539 725 (1993-05-01), None
Patent Abstracts of Japan, vol. 1996, No. 08, Aug. 30, 1996 and JP 08 107272A, Apr. 23, 1996.
Fischer Michael E.
Roozrokh Bahman
Allen Dyer Doppelt Milbrath & Gilchrist, P.A.
Fourson George
Wetherill Associates, Inc.
LandOfFree
Method for manufacturing diode subassemblies used in... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing diode subassemblies used in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing diode subassemblies used in... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3706891