Method for manufacturing conductive pattern substrate

Details Method for manufacturing conductive pattern substrate Method for manufacturing conductive pattern substrate

2005-03-29

2005-03-29

Gurley, Lynne A. (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

C438S597000, C438S616000, C438S669000, C438S671000, C438S942000, C438S945000, C438S948000

Reexamination Certificate

active

06872646

ABSTRACT:
A conductive pattern is obtained by forming concave-convex on a substrate by using a pattern substrate. A conductive thin layer is formed and then coated with a layer of a photosensitive resin. The photo sensitive resin is exposed and development by using the pattern substrate to bare the conductive thin layer on the convex portion and electrolytic plating. The conductive thin layer and the layer of the photosensitive resin on the concave portion may then be removed.

REFERENCES:
patent: 5447767 (1995-09-01), Tanabe et al.
patent: 5492863 (1996-02-01), Higgins, III
patent: 5981866 (1999-11-01), Edelson
patent: 6063701 (2000-05-01), Kuwazaki et al.
patent: 6239356 (2001-05-01), Edelson
patent: 6645856 (2003-11-01), Tanaka et al.
patent: 6653232 (2003-11-01), Uda et al.

Affiliated with

Also associated with

Rating

Method for manufacturing conductive pattern substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing conductive pattern substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing conductive pattern substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3391385