Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Noninterengaged fiber-containing paper-free web or sheet...
Reexamination Certificate
1999-09-17
2001-02-06
Acquah, Samuel A. (Department: 1711)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Noninterengaged fiber-containing paper-free web or sheet...
C524S013000, C524S277000, C524S541000, C524S542000, C428S208000, C428S304400, C428S308800, C428S326000, C428S327000, C428S484100, C428S485000, C428S541000
Reexamination Certificate
active
06183849
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to manufactured composite board products wherein the composite board product is a compressed, heat treated mixture of natural fibrous material, resin and wax.
2. Related Art
Manufactured composite board products, typically wafer board, hard board, oriented strand board, particle board, medium density fiberboard, etc., have been produced for many years and their method of manufacture is well known in the industry.
Typically such board products are produced by using a natural fibrous material as the primary component which is then sprayed, dipped or otherwise combined with a minor amount of resin and slack wax, formed into sheets and subjected to pressure and heat to yield finished, thin, generally stiff sheets of manufactured board materials.
U.S. Pat. No. 4,404,252 describes a surface stabilized waferboard having at least one surface rendered water resistant and stabilized against water loss.
In the process of that patent a wafer board is produced by bonding together wood wafers, adhesive resin and wax in a hot press, the water resistance and surface stabilization of at least one surface being accomplished by bonding a layer of porous paper to at least one surface of the wafer board while the wood wafers are being bonded together in the hot press. The wax employed in producing the wafer board is an aliphatic petroleum product referred to generally as a slack wax and is used in an amount in the range of 1 to 2 wt % of the wafer board, based on the oven dry weight of the wafer board.
While not so recited in the literature the slack wax generally used in the production of manufactured wafer or fiber board is typically 30 grade slack wax (550 N) which typically has an oil content in the range 18-28 wt %, more usually 18-21 wt % oil. A 10 grade slack wax (150 N) has also been used and it has a typical oil content in the range 12-28 wt %, more usually 14-21 wt %.
“The Effect of Wax Type and Content on Waferboard Properties” Hsu, et al, International Particleboard/Composite Materials Symposium, 1990, pp. 85-93, discusses and addresses the effect of wax content and oil content in wax on the physical properties of waferboard. The paper addresses waferboard swelling in response to from zero to 4.5% wax content as well as waferboard swelling and internal bond strength in response to from 0 to 30 wt % oil content in the wax used in the production of the waferboard.
DESCRIPTION OF THE INVENTION
The present invention is a manufactured board product comprising natural fibrous material, resin and a hydrocarbonaceous material comprising one or more natural, synthetic or petroleum waxy material containing from more than 30 wt % oil to up to 98 wt % oil. The present invention also relates to an improved method for producing a manufactured board product comprising combining natural fiber material, resin and oily hydrocarbonaceous material, forming the mixture into a layer and subjecting the layer to heat and pressure, the improvement comprising using as the oil hydrocarbonaceous material a natural, synthetic or petroleum wax containing greater than 30 wt % to up to 98 wt % oil.
REFERENCES:
patent: 3297603 (1967-01-01), Mase
patent: 3340204 (1967-09-01), MacLeod et al.
patent: 3360462 (1967-12-01), Littler
patent: 4404252 (1983-09-01), Hetzler et al.
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patent: WO 98/00464 (1998-01-01), None
“The Effect of Wax Type and Content on Waferboard Properties”, Hsu, Melanson, Kozak, International Particleboard/Composite Materials Symposium, Apr. 3-5, 1990, pp. 85-93.
Ciruna John A.
Lindsay Alan R.
Acquah Samuel A.
Allocca Joseph J.
Exxon Research and Engineering Company
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