Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2011-07-05
2011-07-05
Arbes, C. J (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S840000, C029S852000, C439S066000
Reexamination Certificate
active
07971348
ABSTRACT:
A component-embedded substrate includes a component embedded in an uncured resin layer of a second layer. After curing the resin layer, a hole passing through the second layer in the vertical direction is formed. The hole is filled with an electroconductive paste to form a second interlayer connection conductor. A first in-plane conductor including a plurality of lands, a first layer, and the second layer are respectively stacked in that order and pressed to join together, and the first layer is heated to form an integrated structure. A method for manufacturing the component-embedded substrate can form an interlayer connection conductor having a small diameter and high straightness and thus can achieve a miniaturized component-embedded substrate including interlayer connection conductors at a narrow pitch.
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Arbes C. J
Keating & Bennett LLP
Murata Manufacturing Co. Ltd.
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