Method for manufacturing completely circular semiconductor wafer

Details Method for manufacturing completely circular semiconductor wafer Method for manufacturing completely circular semiconductor wafer

1996-10-31

1998-02-10

Niebling, John

Semiconductor device manufacturing: process

With measuring or testing

438460, G01R 3126, H01L 21302

Patent

active

057168768

ABSTRACT:
In a method for manufacturing completely circular wafers, a specified crystal orientation of a cylindrical semiconductor crystal member is detected, and a blade is mounted on the semiconductor crystal member in accordance with the detected specified crystal orientation. Then, a recognition mark is marked on a top face of the semiconductor crystal member in accordance with a position of the blade. Then, the semiconductor crystal member and the blade are cut to form a semiconductor wafer and a blade piece. Finally, the semiconductor wafer is separated from the blade piece.

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