Method for manufacturing completely circular semiconductor wafer

Details Method for manufacturing completely circular semiconductor wafer Method for manufacturing completely circular semiconductor wafer

1997-11-07

1999-07-27

Scherbel, David A.

Stone working

Sawing

Rotary

125 1301, B28D 104

Patent

active

059272635

ABSTRACT:
In a method for manufacturing completely circular wafers, a specified crystal orientation of a cylindrical semiconductor crystal member is detected, and a support is mounted on the semiconductor crystal member in accordance with the detected specified crystal orientation. Then, a recognition mark is marked on a top face of the semiconductor crystal member in accordance with a position of the support. Then, the semiconductor crystal member and the support are cut to form a semiconductor wafer and a support piece. Finally, the semiconductor wafer is separated from the support piece.

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