Method for manufacturing CMOS image sensor which improves...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

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Details

C438S072000, C257S294000, C257SE27133

Reexamination Certificate

active

07611921

ABSTRACT:
A method for manufacturing a CMOS image sensor is disclosed. The method includes the steps of: forming a passivation oxide and a passivation nitride after forming a pad; performing a hydrogen anneal; selectively removing the passivation nitride and cleaning the passivation oxide; opening and cleaning the pad by removing the passivation oxide from the pad region; forming a pad protection membrane; forming color filter array, planarization layer and a plurality of microlenses; and removing the pad protection membrane from the pad region. A circle defect in a pixel region may be removed according to the disclosed method for manufacturing the CMOS image sensor. Accordingly, the sensitivity of the CMOS image sensor may be increased by raising the quality of the CMOS image sensor and reducing reflectance of the light.

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Joon Hwang; Method of Manufacturing Image Sensor Using Barrier Layer for Restraining Generation of Metal Pad Particles; Publication No. 100504563 B1; Publication Date: Jul. 21, 2005; English Abstract of Korean Intellectual Property Office; Republic of Korea.
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